170204-2 Contact, Crimp, Receptacle, 26-20AWG Amp - Te Connectivity MULTICOMP PRO - MP007418 -

MULTICOMP PRO - MP007418 - Hex Nut

Mounting Hole Dia: 38mm

Bluetooth Low Energy/SoC

Board Type: Plain Copper Board

Single Secondary Voltage: 40VAC

170204-2 Contact, Crimp, Receptacle, 26-20AWG Amp - Te Connectivity MULTICOMP PRO - MP007418 -AMP TE CONNECTIVITY 170204 2 Contact, EI, Socket, Crimp, 20 AWG, Tin Plated Contacts, Amp EI Series Connectors Product Range: EI Series Contact Gender: Socket Contact Termination Type: Crimp Wire Size AWG Max: 20AWG Contact Plating: Tin Plated Contacts For Use With: Amp EI Series Connectors Wire Size AWG Min: 26AWG Contact Material: Phosphor Bronze SVHC: No SVHC (15 Jan 2019) Contact Termination: Crimp Wire Size (AWG): 26AWG to 20AWG