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Ships within 48 hours · Estimated delivery Oct 26 - Oct 31
Reserve from the case
Ships within 48 hours · Estimated delivery Oct 26 - Oct 31
MULTICOMP PRO - PP001259 - Wire
MULTICOMP PRO - MCMR04X103 JTL - SMD Chip Resistor
Temperature Sensing Point 5: 241°C
LPC82x Capacitive Touch Solution
DELTRON ENCLOSURES - 459-0030 - Metal Enclosure
AGP30 Pad, Protoboard, 160X300, 1F Cif MULTICOMP PRO - PP001259 -CIF AGP30 Protoboard, Pad, Epoxy Glass Composite, 1. 57mm, 160mm x 300mm Board Type: Matrix Board Board Material: Epoxy Glass Composite Hole Diameter: 1mm External Height: 160mm External Width: 300mm Board Thickness: 1. 57mm SVHC: No SVHC (15 Jan 2019) External Length Height: 160mm Hole Pitch: 2. 54mm Material: Fibreglass Epoxy No. of Copper Coated Sides: 1 Pitch Spacing: 2. 54mm Row Pitch: 0. 54mm
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